Hi Guys

I am wondering if anyone can provide some ESD tutorials about the power clamp, back to back diode and HBM model etc.

Best regards,

liletian wrote on Apr 9^th, 2018, 10:53am:



The Power clamp is GGNMOS or SCR, the back to back diode is supposed to be used between DGND and AGND.
1),The GGNMOS is very effective and robust, the scr is  used carefully for latch-up characteristci.
2),back to back diode is used to the noise and ESD ability
3),the HBM model is the test model or simulation model?
   the HBM test model are componet and system
   the HBM simulatiom model often refer to tlp , there is few spectre simulatiom mode except the mos discharge through mos channal